G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G98-1122 - Current SEMI 3D5 — Guide for

SEMI 3D5 — Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures

The purpose of this Test Method is to define a method for determining numerical values for surface roughness parameters measured on gas distribution system components

Chips and scratches can be origins for crack generation

3  This Standard defines only horizontal and vertical viewing angles for measurement

and thickness of the gold plating shall be specified per MIL-G-45204 unless otherwise agreed between vendor and customer

G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G98-1122 - Current SEMI 3D5 — Guide forMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of