F04700 - SEMI F47 - 半導体プロセス装置電圧サグ対応力のための仕様 StdTpc-Ball Grid Arrays Alternatively closed vessel thermal conduction

Alternatively closed vessel thermal conduction heating may also be applied

Fab-specific details include fab type

previously published in 1995

Defects that are non-uniformly distributed (e

9-0698 (Reapproved 0615)

F04700 - SEMI F47 - 半導体プロセス装置電圧サグ対応力のための仕様 StdTpc-Ball Grid Arrays Alternatively closed vessel thermal conductionglobal Facilities Technical Committee2012618global Audits and Reviews Subcommittee20128www. semiviews. org www. semi. org1999920067 & CVD & PVD CMP & 2 ACAC EMO Grandfather Clause Referenced SEMI Standards SEMI E51 Guide for Typical Facilities Services and Termination Matrix SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment