M03100 - SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers Revision:SEMI M31-0305 - Superseded Direction for improvement for equipment

Direction for improvement for equipment manufacturers will become clear

development

The objective of this Test Method is to describe a general set of instrument parameters and conditions that will achieve reproducible measurements within the chromium-enriched passive oxide layer

This Specification covers requirements for all grades of dichlorosilane (SiH2Cl2) used in the semiconductor industry

this TDDB test method has a higher sensitivity for detecting the accidental breakdown (B mode) than TZDB

M03100 - SEMI M31 - Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers Revision:SEMI M31-0305 - Superseded Direction for improvement for equipmentNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard specifies the front opening shipping box (FOSB) used to ship 300 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality. This Standard is intended to