P02000 - SEMI P20 - Guideline for Catalog Publication of EB Resist Parameters (Proposal) StdTpc-Leadframes It has been replaced by

It has been replaced by SEMI F119

SEMI C30-0301 (technical revision)

半導体製造工場は装置の敏感性とプロセス制御の観点から高品質な電源を必要とする。半導体プロセス装置は電圧サグの影響を特に受けやすい。本仕様は，半導体プロセス装置，計測装置，自動試験装置に必要な電圧サグ対応力を定義にする。本仕様は，電圧サグ対応力と装置費用増加との間のバランスを考慮している。

이 문서(Document)는 내부 버퍼 장비의 캐리어 전송뿐만 아니라

Standardization of these component interfaces will allow for interchangeability of gas distribution system components

P02000 - SEMI P20 - Guideline for Catalog Publication of EB Resist Parameters (Proposal) StdTpc-Leadframes It has been replaced byThis guideline was technically approved by the Global Micropatterning Committee and is the direct responsibility of the Japanese Micropatterning Committee. Current edition approved by the Japanese Regional Standards Committee on April 28, 2003. Initially available at www. semi. org June 2003; to be published July 2003. Originally published in 1992. NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain