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AP435 Automatic Glue Dispensing System (Reduces the max. Board Size to: 400 x 295 mm) UL Series Effective debris removal: clears solder
AP435 Automatic Glue Dispensing System (Reduces the max. Board Size to: 400 x 295 mm) UL Series Effective debris removal: clears solder
$3997.50
Description
Effective debris removal: clears solder paste and residue from stencil apertures
Stable wave temperature: consistent soldering results
Industrial Control Architecture and Reliability
repeatable dispensing
Statistical process control (SPC) software for traceability
AP435 Automatic Glue Dispensing System (Reduces the max. Board Size to: 400 x 295 mm) UL Series Effective debris removal: clears solderAP435 Automatic Glue Dispensing System
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.