G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Revision:Default Title and incoming or outgoing inspection

and incoming or outgoing inspection

This edition was approved for publication by the global Audits and Reviews Subcommittee on December 20

本安全ガイドラインは，Environmental Health & Safety Global Technical Committeeで技術的に承認されている。現版は2015年1月5日，global Audits and Reviews Subcommitteeにて承認された。2015年5月にwww

注意：SEMI E142

SEMI M54-0319 (technical revision)

G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling Revision:Default Title and incoming or outgoing inspectionThis document is prepared to enable standard measurement techniques to be used. It is intended that the measurement techniques described in the specification will apply to all molded plastic package tooling (i. e., DIPS, SIPS, PCC, SO, Quad, and TAB). Referenced SEMI Standards SEMI G14 Plastic Molded DIP Tooling SEMI G16 Plastic Chip Carrier Tooling SEMI G36 Plastic Molded High Density TAB Quad Tooling SEMI G37 Plastic Molded SO Package Tooling