Ge Substrate (111) 10x10x 0.5 mm, 1 SP, N-type Undoped .R>50 ohm.cm Flanges especially for cutting plastics

especially for cutting plastics

Wafer size: 2" diameter x 0

5MPa (the cap valve will open to release interior high pressure -- if over 2

Bottom Pressing Rod Head Thickness: 7

Thickness:         0

Ge Substrate (111) 10x10x 0.5 mm, 1 SP, N-type Undoped .R>50 ohm.cm Flanges especially for cutting plasticsSpecifications Growing Method: CZ Wafer Size: 10x10x0. 5 mm Surface Polishing: one side epi polished Orientation: (111) Surface roughness: < 8 A ( by AFM) Doping: Undoped Conductor type: N type Resistivity: >50 Ohms cm EPD: N A Package: under 1000 class clean room in wafer container Related Product Other Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater