Environmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Ingestion-build-51747 The test method documented in

The test method documented in BS EN 61000-4-6 describes a consistent method to assess the immunity of an equipment or system against a defined phenomenon

and other characteristics for hard-drawn high conductivity copper and copper alloy conductors

by adopting BS EN 251 guidelines you can ensure that your products are safe

including the following aspects:

principles and quality system elements of the standard are applicable to all forms of manufactured products and help create competitive products that are produced on time

Environmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Ingestion-build-51747 The test method documented in1 Scope This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens