Boron Nitride Film on Silicon Wafer, 24 nm / 4" -- BN-Si-100-24nm - FmBNonSia100D0525C1FT24nm Crushers & Grinders ball milling

ball milling

180-200C for upper blade

Surface Roughness: < 50 microns

Working Voltage 208-240V AC Max

Notice: It is suggested to use an external hard drive to keep an instant backup of the collected data

Boron Nitride Film on Silicon Wafer, 24 nm / 4" -- BN-Si-100-24nm - FmBNonSia100D0525C1FT24nm Crushers & Grinders ball millingBoron Nitride Film Boron nitride is a chemical compound with the chemical formula BN, consisting of equal numbers of boron and nitrogen atoms. BN film is amorphous t Its hardness is inferior only to diamond, but its thermal and chemical stability is superior. Low pressure deposition of thin films of boron nitride is grown on Si (100) wafers for this product by sputtering BN Film coated by sputtering method The amorphous structure ( no orientation)