LaAlO3, (110) orn. EPI polishing 3" x 0.5mm wafer 1 SP --- MTI Special !!!-1 Te 10-100 cc/min
$540.50
Description
10-100 cc/min
Motor & Spindle The 1/4 HP equivalent variable speed ball bearing direct drive motor allows the saw to run fast enough to use ultra-thin diamond blades
DO NOT set the pressure gauge above 90 psi (0
001 Ca (wt%) <0
Polish: One side EPI polished by CMP tecnology with less sub-surface lattice damage
LaAlO3, (110) orn. EPI polishing 3" x 0.5mm wafer 1 SP --- MTI Special !!!-1 Te 10-100 cc/minSubstrate Specifcations: Wafer Size: 3" dia + 0. 5 mm x 0. 5 thickness + 0. 05 mm Wafer Orientation: (110) + 0. 5 Deg Edge Orientation: <001> + 1 Deg with 20 mm Length Polishing: CMP polished with free sub surface damaged Surface finish (RMS or Ra) : < 15A Package: Under 1000 class clean room, and in 100 grade plastic bag in a wafer container. Lattice Constant a=3. 792Pseudo cubic Warning: LaAlO3 crystal has a visible twin on a polished surface, which
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