Integrated circuits. Three dimensional integrated circuits - Model and measurement conditions of through-silicon via Ingestion-build-132972 What is BS EN 13463-1:2009

What is BS EN 13463-1:2009

h)     Alternative requirements for sound pressure

This standard sets out principles to be followed for both layout and calculation

ISO 20613 discusses sensory analysis

The cableway installations designed for carrying people must draw up safety measures against fire protection to ensure the safety of passengers as well as staff

Integrated circuits. Three dimensional integrated circuits - Model and measurement conditions of through-silicon via Ingestion-build-132972 What is BS EN 13463-1:2009What is BS IEC 63011 3 about? BS IEC 63011 3 is the third part of the BS IEC 63011 series of standards that specifies a reference model of through silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3 D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3 D IC. Note: 3 D IC specifications covered by BS