ori. sapphire wafer is being used extensively as a substrate for III V nitrides and magnetic epitaxial films due to its better lattice mismatch Wafer size: 2" dia x 0. 5 mm thickness Orientaion: M plane <10 10>orn + 0. 5 Deg Polished surface: Wafer surface is EPI polished via a special CMP procedure. Price listed here is for one side polished Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with"> ori. sapphire wafer is being used extensively as a substrate for III V nitrides and magnetic epitaxial films due to its better lattice mismatch Wafer size: 2" dia x 0. 5 mm thickness Orientaion: M plane <10 10>orn + 0. 5 Deg Polished surface: Wafer surface is EPI polished via a special CMP procedure. Price listed here is for one side polished Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with"> ori. sapphire wafer is being used extensively as a substrate for III V nitrides and magnetic epitaxial films due to its better lattice mismatch Wafer size: 2" dia x 0. 5 mm thickness Orientaion: M plane <10 10>orn + 0. 5 Deg Polished surface: Wafer surface is EPI polished via a special CMP procedure. Price listed here is for one side polished Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with"> Al2O3- Sapphire Wafer, M Plane, 2"Dia x0.5mm, 2SP - ALM50D05C2 Orientation 100 04 (74 – imh-uni.org

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Al2O3- Sapphire Wafer, M Plane, 2"Dia x0.5mm, 2SP - ALM50D05C2 Orientation 100 04 (74

$112.12

Quantity
Description

04    (74

Whole set  pressing die includes Double layer structure 120mm dry pressing die

the glove box can be vacuumed by a mechanical pump up to 0

Orientation <111> +/- 2 o

M plane orientation

Al2O3- Sapphire Wafer, M Plane, 2"Dia x0.5mm, 2SP - ALM50D05C2 Orientation 100 04 (74Features: M <10 10> ori. sapphire wafer is being used extensively as a substrate for III V nitrides and magnetic epitaxial films due to its better lattice mismatch Wafer size: 2" dia x 0. 5 mm thickness Orientaion: M plane <10 10>orn + 0. 5 Deg Polished surface: Wafer surface is EPI polished via a special CMP procedure. Price listed here is for one side polished Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with

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