Solderless connections - Compression mount connections. General requirements, test methods and practical guidance Ingestion-build-115288 This regression is distinguished from

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Solderless connections - Compression mount connections. General requirements, test methods and practical guidance Ingestion-build-115288 This regression is distinguished from1 Scope and object This part of IEC 60352 is applicable to compression mount connections with metallic spring contacts for use in telecommunication equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is