99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> 99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater"> BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods Laser Mark: none – imh-uni.org

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BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods Laser Mark: none

$744.62

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Description

Laser Mark: none

Hydraulic Pressure in Chamber 300 Mpa ( 43500 PSI)  Hydraulic Machine optional

Use the provided pins to position the demolding for easy lining up

05o to M-plane leftwards from the Primary

75 um (+/- 20%)

BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods Laser Mark: noneComposition: Bismuth Iron Oxide BiFeO3 Target 3" Dia x 0. 125" Thick bond to Copper(Cu) backing plate(0. 111" thick) Purity: > 99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater

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