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Bambu Lab - H2C - Plateau Technique (Engineering Plate) GF30-PA6 Température d'extrusion 200-230ºC Température du

$51.26

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Température d'extrusion 200-230ºC Température du plateau 60-80ºC Plateau chauffant Optionnel

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Vaisselle en métal

220 x 500 mm (avec conveyeur) Puissance du laser et source laser Laser fibre 20 W + laser diode 20 W

Bambu Lab - H2C - Plateau Technique (Engineering Plate) GF30-PA6 Température d'extrusion 200-230ºC Température du

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